Abstract
The EPEP topical meeting provides the most comprehensive and in-depth forum for the presentation and discussion of the latest advances in electrical design, analysis, and characteriza- tion of on-chip and packaging interconnections and structures for digital, mixed signal, and RF-microwave applications. The meeting is aimed at bringing together researchers and practicing engineers from industry, universities, and government labora- tories from around the world to discuss current and future is- sues affecting the electrical performance of high-speed elec- tronic systems. A keynote talk presented by Stephen L. Smith of Intel addressed future challenges in achieving the digital home. Sessions were organized to cover key areas affecting future elec- tronic packaging structures including system implications of packaging, transmission lines, RF-microwave packaging, noise reduction, power distribution, on-chip interconnect modeling,
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