Year-end Sale % OFF 
Abstract
By exploiting the ability of ionic liquids to solubilize molecular sulfur at the melting point, we report the electrodeposition of CuS in an [EMIm]TFSI (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide) electrolytic bath containing Cu(TFSI)2 salt and elemental sulfur. Single-crystal and preferentially oriented covellite CuS thin films with flake morphology have been successfully obtained. Li/CuS coin cells using the deposits after carbon coating as the positive electrode show a discharge capacity of 350 mA h g−1 with capacity retention of 54.4% after 20 cycles.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
