Abstract

In this study, we demonstrate a high-quality aluminum nitride (AlN) film with a thickness of 2.5 μm grown on 4H-SiC substrate using a three-dimensional (3D) buffer via high-temperature metal-organic chemical vapor deposition. For the buffer layer, 3D structure morphology without polycrystals was selected by the temperature change from 850 to 1350°C. The main layer was grown on the 3D buffer, and self-assembled nanovoids were formed, enabling the growth of a high-quality AlN film without cracks. However, many cracks occurred in the sample without a buffer. The full width at half maximum of the X-ray rocking curve was 144/368 arcsec for (002)/(102) planes, respectively. Cross-sectional transmission electron microscopy showed nanovoids and a rapid defect reduction effect at the interface of the buffer layer.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.