Abstract

AbstractAs the demands for InP epitaxial materials grow, the need for larger throughput growth techniques becomes important. However, uniformity of thickness and particularly composition of InGaAs and InGaAsP films has proved troublesome. This has limited much of the InGaAsP growth work to single wafer machines. The purpose of this work is to demonstrate good film properties and uniformity on a multi-wafer machine that holds three, two-inch diameter wafers.

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