Growth of gallium cerium oxide passivation layer on 4H-Silicon carbide substrate and its metal-oxide-semiconductor characteristics

Abstract

Gallium cerium oxide (GaxCeyOz) passivation layer was successfully grown on 4H-silicon carbide (SiC) through postdeposition annealing at 800 °C in nitrogen-oxygen-nitrogen (N2–O2–N2) ambient. The gracing incident X-ray diffraction and ultraviolet–visible spectrophotometer measurements have confirmed the successful incorporation of Ga3+ cation into the CeO2 lattice to form the ternary GaxCeyOz passivation layer. In addition, the thicknesses of GaxCeyOz passivation layer and silicon dioxide (SiO2) interfacial layer (IL) were determined using field-emission scanning electron microscopy and X-ray reflectivity characterizations. A high dielectric constant (k) value of 24.11 was attained for the investigated Al/GaxCeyOz/4H–SiC/Al metal-oxide-semiconductor (MOS) structure attributable to the nitrogen ions accumulating at the interface that have retarded the growth of SiO2 IL. Besides, the effective oxide charge, slow trap density, interface trap density, interface state density, as well as leakage current density-electric field characteristic of the investigated GaxCeyOz passivation layer on 4H–SiC substrate was presented in this work.