Abstract
Microdendritic copper deposits of various morphologies were electrolytically produced and bonded with an epoxy resin. The adhesion strength and failure mode of the copper bond were evaluated by means of T-type peel tests and SEM, EDS surface analyses. The general effects of independent process parameters on deposit quality and adhesion were studied. It was found that microdendritic deposits of relatively high surface area and strength produced electrolytically improved adhesion between metal and polymeric adhesive through enhanced mechanical interlocking or anchoring.
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