Abstract
In this study, the characteristics of growing an intermetallic compound(IMC) layer at solder joint in photovoltaic (PV) ribbon solder joint were investigated through the thermal ageing test. Also, the growth rate of IMC in the ribbon solder joint, which depend on the temperature and time, was predicted through the ageing test. That the ageing test were performed under three different conditions: 90 °C, 120 °C and 150 °C. Also, we prepare the two type solder composition(60Sn40Pb, 62Sn2Ag36Pb) to analyze Ag addition effect in solder to forming IMC layer. Following testing, the IMC layer formed Ag3Sn in Ag sintered layer by Sn diffusion phenomena at high temperature. The thickness of Ag3Sn in solder joint was measured by cross-section images during the thermal ageing test. The Ag3Sn IMC layer was filled in sintered Ag layer in 70 h under the harshest conditions of 150 °C and 750 h at 120 °C. The Ag3Sn thicknesses were calculated to activation energies forming IMC layer in solder joints. The results, the Ag3Sn growth rates under the various temperatures were predicted for long-term reliability of PV modules.
Highlights
The generation of power from renewable sources has been expected to bridge the gap between global power demands and the current supply of power
supplemented with tin (Sn) diffusion phenomena [8, 10] was verified; the Ag3Sn intermetallic compound (IMC) was formed via Sn diffusion from the solder and sintered Ag interface toward the inside of the sintered Ag layer when the PV ribbon solder joint was exposed to high temperatures
The A g3Sn IMC layer was observed to grow toward the sintered Ag until reaching a thickness of 18 um, which was the thickness of the sintered Ag layer, over 70 h under the harshest test conditions (150 °C)
Summary
The generation of power from renewable sources has been expected to bridge the gap between global power demands and the current supply of power. Direct conversion technologies based on solar photovoltaics possess several positive attributes and appear to be very promising [1, 2, 5, 11, 21, 28, 30]. International Journal of Precision Engineering and Manufacturing-Green Technology (2020) 7:89–96 sintered Ag possess porous structures and exhibit different tendencies from microelectronic systems with regard to interfacial mechanisms and composition. Electrical connections between solder and Ag electrodes are not recommended for long-term applications due to Ag leaching phenomena [16]. For these atomic diffusions and forming IMCs layer, the various method have being tested. The added Ag in SnPb solder could make the fine solder grain size, it cause the reinforcement mechanical properties of solder joints
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: International Journal of Precision Engineering and Manufacturing-Green Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
