Abstract

A modified method is applied to grow a void-free 3C-SiC thin film of better crystal quality on the Si(100) substrate in a mixed gas of C3H8, SiH4 and H2 using low pressure chemical vapor deposition. The modified method adds a low temperature and low pressure heat treatment step after the clean step and subsequent a high flow carbon-based precursor gas-on step. The X-ray intensity of the 3C-SiC(200) peak is enhanced intensively using this modified method. The better crystal quality of 3C-SiC is confirmed by both X-ray diffraction and Raman spectra data. The modified method leads to a better crystal quality and surface morphology of the 3C-SiC film grown on Si(100) due to the better carbonized surface morphology. Moreover, the modified method can completely remove the void formation during the whole process. Morphological and structure analysis using scanning electron microscopy and transmission electron microscopy reveal no void defects at the 3C-SiC/Si(100) interface.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call