Abstract
In the microelectronics industry, many solder junctions rely upon reaction between a copper substrate and a molten tin-based alloy. For the tin/copper system, interfacial continuity is afforded by the formation of the η (Cu6Sn5) and ɛ (Cu3Sn) phase intermetallic compounds. The η grows in a scalloped morphology along the tin interface with whiskers emanating from their tops. This article quantitatively describes the unusual growth behavior of the η phase scallops and whiskers formed during reaction of liquid tin with a solid copper substrate.
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