Abstract
The growth mechanism of CuNi multilayers, electrodeposited from a single bath on a polycrystalline copper substrate, has been studied both electrochemically and through transmission electron microscopy. It is shown that CuNi multilayers grow epitaxially sequentially in the preferential crystallographic directions 〈110〉 and 〈111〉, when the modulation distance is less than approximately 10 nm. Above this value, the epitaxial growth is progressively replaced by a growth mechanism which is based on nucleation followed by grain growth. This work also demostrates that electrodeposition has a capacity to produce CuNi multilayers with modulation distances below 5 nm.
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