Abstract
In this study, the effects of multi-walled carbon nanotubes reinforcement on the thickness and growth kinetics of interfacial intermetallic compound (IMC) layer in Sn–5Sb solder system are investigated. In the typical study, plain Sn–5Sb solder system and carbon nanotubes reinforced solder systems (Sn–5Sb−xCNT; x = 0.01, 0.05 and 0.1 wt%) were developed via the powder metallurgy approach. The solder/Cu joints subjected to the as-reflow and isothermal aging (170 °C) conditions were systematically characterised to evaluate the growth of the IMC layer. Results suggest that the composite solders showed better results for all subjected conditions compared with the plain solder. In particular, 0.05 wt % CNTs reinforced solder system exhibited the most appreciable IMC layer suppression and diffusion coefficient among all the samples analysed in this study.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Materials Science: Materials in Electronics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
