Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test

Abstract

Sn63Pb37/SAC305 mixed solder joint is inevitably in the electronic device requiring high reliability, such as health care, aerospace etc. However, the usage history of mixed solder joint is relatively short and as such their interfacial behaviour and reliability in service has not been completely figure out. Herein, the evolution of microstructures in fully mixed Sn63Pb37/SAC305 BGA solder joints during high-temperature storage were systematically studied. After reflow soldering process, the Pb-rich phases uniformly distributed in the fully mixed joint. During the thermal aging test, the size of Pb-rich phases gradually coarsened. The intermetallic compound (IMC) layers thickness at the two-side interface (upper interface: between the pad on substrate and solder; lower interface: between the pad on PCB and solder) were also increased. Moreover, the growth kinetics models of two-side IMC layer were successfully established according to the Arrhenius equation. IMC layer grows faster at higher temperature, because of higher diffusion coefficient. With the increasing of aging time, the fracture position partially moved from the interface between Ni layer and IMC layer into IMC internal. These results may provide support for the reliable applications of mixed Sn63Pb37/SAC305 solder joints.