Abstract
Two approaches have been compared for the low temperature epitaxy of thick, partially relaxed GeSn layers on top of Ge strain relaxed buffers. The benefit of using step-graded instead of constant composition layers when targeting really high Sn contents (16%, here) was conclusively demonstrated. Digermane (Ge2H6) and tin-tetrachloride (SnCl4) were used as Ge and Sn precursors, respectively. The growth pressure (100 Torr) and the F(Ge2H6)/F(SnCl4) mass-flow ratio being constant, it was through a temperature lowering that the Sn concentration in the graded structure was increased. X-ray diffraction, atomic force microscopy and transmission electron microscopy were used to gain access to the Sn concentration, the strain state, the surface morphology and thicknesses of the heterostructures. Using a step-graded approach allowed us to gradually relax the strain in the GeSn layers. It helped us obtain high crystalline quality and avoid Sn segregation/precipitation for high Sn contents.
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