Abstract

Nano-crystalline Ni and Cu films deposited on the r-plane of sapphire (α-Al2O3) develop a 〈1 1 1〉 fiber-texture upon annealing, in which grains grow up to 300 to 500 times larger than the film thickness. Most of the largest grains, which have grown at the expense of others, display one of four preferred orientation relationships (ORs) to the substrate. The four preferred ORs are OR1r = Me(1 1 1)[11¯0]//α-Al2O3(11¯02)[112¯0], OR2r = Me(1 1 1)[11¯0]//α-Al2O3(11¯02)[1¯101] (Me = Ni or Cu), and their twins, which are rotated 60° about the 〈1 1 1〉 axis perpendicular to the substrate. For these ORs, one of the densest 〈1 1 0〉 atomic rows that lies within the Me {1 1 1} interfacial plane, aligns with the direction of the step edges that form at the intersection of the r-plane with one of its neighboring facets on the equilibrium shape of sapphire (i.e. the c- (0 0 0 1), p-{112¯3} or s{101¯1}-planes). One of the ORs is most preferred when the steps at the interface are such that a {1 0 0}-type ledge of the Me {1 1 1} interfacial plane faces the ledge of the sapphire step. This observation provides a useful insight into the origin of the preferred ORs, and confirms the important role of surface steps in texture development. The evolution of Ni films of different thicknesses, ranging from 100 to 560 nm, was analyzed. Grain boundary grooving inhibits grain boundary motion and favors hole formation and dewetting in the thinnest films (100 nm). The crystals left behind after dewetting display ORs which may differ from the preferred ones. Large grains with the preferred ORs can grow at the expense of others when the film thickness is greater than 300 nm.

Highlights

  • Basic studies of the heteroepitaxy of metallic films on single-crystalline oxide substrates are aimed at understanding interfacial atomic structure and bonding, in order to predict the properties of the technologically important devices that contain them

  • The results show that the preferred orientation relationships (ORs) are induced in the film by the directions of substrate steps that result from the miscut of the sapphire crystal during wafer production

  • The surface consists of large “blurred” terraces about 450 ± 50 nm wide separated by 0.30 ± 0.03 nm high steps, i.e. the wafer surface is miscut off the r-plane by 0.04°, and is tilted by an angle 20 times larger than the curvature defect of the wafer

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Summary

Introduction

Basic studies of the heteroepitaxy of metallic films on single-crystalline oxide substrates are aimed at understanding interfacial atomic structure and bonding, in order to predict the properties of the technologically important devices that contain them. For this purpose, interfaces have been investigated in model systems such as face-centered cubic (fcc) metallic films or particles grown on sapphire (α-Al2O3) substrates. Polycrystalline fcc metallic films tend to develop a 〈1 1 1〉-fiber texture when annealed on substrates which do not match their lattice parameter. The large atomic lattice mismatch between sapphire and these metals rules out the possibility that a coherent interface will develop in order to minimize the interfacial strain energy. It has been observed that the preferred OR of large grains of Al [1,3] and Cu crystals [10] on the c-plane of sapphire depends on the annealing temperature

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