Abstract
_m for rough grinding and 0.1–1 _m for fine grinding, a crossfeed of 3 mm and 1 mm for rough and fine grinding, respectively,while maintaining a constant table feedrate of 20.8 m min -1 . Surface integrity of the ground surfaces and subsurfaces was analysed using a scanning electron microscope and a profilometer. Grinding using a 3000-grit diamond wheel at depths of cut of 1 _m and 0.5 _m produced ductile streaks on the Al2O3 particles and the SiC particles, respectively. There was almost no subsurface damage except for rare cracked particles when fine grinding with the diamond wheel.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: The International Journal of Advanced Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.