Abstract
_m for rough grinding and 0.1–1 _m for fine grinding, a crossfeed of 3 mm and 1 mm for rough and fine grinding, respectively,while maintaining a constant table feedrate of 20.8 m min -1 . Surface integrity of the ground surfaces and subsurfaces was analysed using a scanning electron microscope and a profilometer. Grinding using a 3000-grit diamond wheel at depths of cut of 1 _m and 0.5 _m produced ductile streaks on the Al2O3 particles and the SiC particles, respectively. There was almost no subsurface damage except for rare cracked particles when fine grinding with the diamond wheel.
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