Abstract
Based on the orderly distribution alumina bubbles in working layer the porous composite-bonded CBN wheels were fabricated and grinding experiments of nickel-based alloy were carried out in comparison of the vitrified counterpart. Results show that the grinding force decreases and increases respectively with the increasing wheel velocity and depth of cut. The specific grinding energy reduces graduately from 465 to 93 J/mm3when the maximun underformed chip thickness increases from 0.4 to 1.7 μm. Compared to the vitrified CBN wheel, the grinding forces, temperatures and specific grinding energy of the porous composite-bonded CBN wheel are always lower than that of the vitrified one. Its attributed to the graphite lubricating and alumina bubbles pore-forming effects. The larger chip storage space, sharper grit edge and less adhesion on the wheel surface surpport the advantages of the porous CBN wheel.
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