Grid connected CM noise considerations of a three-phase multi-stage SST

Abstract

Solid State Transformer (SST) is an alternative to the conventional distribution transformer for smart grid applications. By employing a compact Medium-Frequency (MF) transformer for isolation, the SST has merits on size and weight. It also provides flexible utilization as a FACTS component. The switching converters are a potential source of Common-Mode (CM) and HF EMI noises. These noises are more nuisance in a SiC device based SST which switches at a high dV/dT at the Medium-Voltage (MV) level resulting in high CM voltages. The SST floating metalic surfaces such as heatsink and the output must be grounded for safety and smooth operation. However there are various significant low impedance paths present, including the parasitics of the compact transformer, which may conduct CM noise to the grid. The generated CM noise may affect the controls. This paper presents the CM and grounding challenges in the multistage integration of a three-phase SST system based on 15kV SiC IGBTs termed as Transformerless Intelligent Power Substation (TIPS). The TIPS interfaces MV 13.8kV and LV 480V grids using MV ac-dc, MV to LV dc-dc dual active bridge and LV dc-ac inverter stages. A study on the CM noise in the TIPS and a passive filter solution for its attenuation is presented in this paper. A time domain simulation considering the passive filter specification is also presented. The experimental results for line to line 3.64kV MV grid integration are presented. A LV prototype is used to verify the complete grounding and the CM choke design at a scaled-down condition.