Green scheduling of dual-armed cluster tool based on cleaning scenarios

Abstract

Semiconductor manufacturing is one of the most complex manufacturing systems, of which wafer fabrication is the core part. Dual-armed cluster tool is widely used in the wafer manufacturing industry with its efficient production characteristics. The scheduling process of the dual-armed cluster tool has to consider many constraints; wafer residency time constraints, activity time fluctuations, etc. are relatively basic requirements. With the improvement of wafer processing accuracy in the market, green scheduling and processing efficiency are emerging as key issues for research, the scheduling of dual-armed cluster tool considering the above constraints is an NP-hard problem. Based on this study, the clean scenario is divided, a scheduling model that can realize low-carbon production is constructed, and the scheduling idea of the dual-armed cluster tool under clean transient is analyzed to ensure that the clustering tool is in green scheduling and restored to a steady state as soon as possible during the scheduling process.