Abstract

Green InGaN-based light-emitting diodes (LEDs) with roughened microhole-array (MHA) structures were fabricated through a dry etching process and a photoelectrochemical (PEC) process. The PEC process consisted of a bandgap-selective lateral etching process at the InGaN active layer, an N-face bottom-up crystallographic etching process at the bottom p-type GaN:Mg layer, and a PEC oxidation process at the n-type GaN:Si surface. The light output power of the MHA-LED and the photoelectrochemically treated microhole-array light-emitting diode (PMHA-LED) had 7 and 65% enhancement, respectively, compared to a conventional LED at a 20 mA operation current.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call