Abstract
AbstractExtreme ultraviolet lithography (EUVL) is widely employed in the electronics, automotive, military, and AI computing areas for IC chip fabrication. A pellicle is a thin and transparent membrane that protects a costly photomask, known as a reticle, during the EUVL process. The fabricated IC chip can be disastrous without a pellicle. When a particle lands on a photomask, it frequently results in a faulty pattern, which leads to chip failure and lower production yield. A nanometer‐thick graphite (NGF) has demonstrated tremendous potential for addressing optical, mechanical, thermal, and chemical criteria among potential pellicle materials such as carbon allotropes, Si, SiNx, and Si‐Mo‐Nb. This review summarizes current progress in NGF pellicles, including large‐scale material fabrication (up to 135 mm × 135 mm), transfer method for freestanding form, and practical characterization methods. Current significant challenges and future opportunities for NGF pellicles are also discussed in order to facilitate a critical transition from lab‐scale research to industrial‐scale implementation.
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