Graphene Fiber Film: A Promising Thermal Management Material in a Wide Temperature Range

Abstract

With the higher integration and higher power of modern electronics, heat dissipation has become one of the bottlenecks restricting the development of advanced microelectronics manufacturing industry. Thanks to the remarkable thermal transport properties of graphene, its potential applications in thermal management has been widely studied. Herein we studied the intrinsic thermal transport properties of two new graphene fiber films using the transient electro-thermal technique (TET) and further investigated the underlying mechanisms for thermal transport in these materials. By controlling the environment temperature in a vacuum chamber, the measured thermal diffusivities at different temperatures were obtained. The intrinsic thermal diffusivities of graphene fiber films were then determined through fitting and calculation to eliminate the effects caused by thermal radiation and convection. The results showed that, the thermal diffusivity of sample 1 increases from 26.67 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /s at 468 K to 101.98 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /s at 108 K. The thermal diffusivity of simple 2 increases from 94.15 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /s at 465 K to 433.96 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /s at 100 K. SEM, Raman spectroscopy and XRD measurement demonstrate that the main reason for the difference in thermal transport ability of the two samples is the different structural connection between graphene fibers, which domains phonon transport in this graphene-bases materials. Considering the high porous structure, these graphene fiber films, especially sample 2, shows very high thermal transport ability, which means it can be a promising thermal management material.