Abstract
This study was carried out to investigate the effects of grain size on mechanical properties in Cu-Sn foil with a thickness of 30 um. The grain size was varied from approximately 7 um to 50 um using heat treatment at 773 K for 2 h to 24 h in a vacuum atmosphere. Tensile test was carried out at room temperature with strain rate of 1mm/min. Typical yield drop phenomenon was observed. Mechanical properties were found to be strongly affected by microstructural features including grain size. The yield strength and tensile strength gradually decreased with increasing the grain size. The strain to fracture also decreased by grain growth. These results could be explained by not only the grain size dependence of yield strength but also the ratio of thickness to grain size dependence of yield strength.
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