Abstract
Gradient ultra-fine-grained microstructures of pure copper were obtained via surficial cryogenic grinding. The microhardness increased gradually from 110 to 158 HV, corresponding to the nondeformed matrix and the surficial materials, respectively. Elongated and equiaxed ultrafine grains were observed. The modes of grain refinement in the severe cryogenic plastic deformation were identified: split of the grains and dynamic recrystallization, corresponding to different strain rates, respectively.
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