Abstract
The grain morphology evolution and mechanical strength change of the intermetallic joints formed in a Ni/Sn/Cu system by the transient liquid phase (TLP) soldering at 260°C, 300°C and 340°C were investigated. The grain morphology evolution of the (Cu, Ni)6Sn5 intermetallic compounds (IMCs) was highly correlated with the Ni concentration gradient across the joints and strongly affected by the soldering temperatures, which was analyzed in detail from the aspect of thermodynamics. The shear strengths of the three types of intermetallic joints were 49.8MPa, 50.3MPa and 42.7MPa, respectively. The correlation between the grain morphology evolution and the mechanical strength change of the intermetallic joints was revealed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
