Grain Growth in Al-2% Cu Thin Films

Abstract

The grain size and grain growth kinetics in sputter deposited Al-2% Cu films on silicon substrates were determined by TEM for various film thicknesses and anneal times, temperatures and methods. Grain sizes were found to be typically lognormally distributed. The as- deposited grain size (d{sub o}) dependence on film thickness (TH) was found to be d{sub o} = C TH{sup {1/2}}, due to competitive grain growth during film formation. Annealed grain size (d) after Rapid Thermal Annealing (RTA) for time (t) at temperature (T) is described by the general equation d {minus} do = C TH{sup 0.7} {l brace}t exp ({minus}{Delta}E{sub a}/kT){r brace}{sup 1/8}, where {Delta}E{sub a} = 0.85 ev for 0.4 {mu}m films and {Delta}E{sub a} = 1.1 ev for 0.8 {mu}m films. Grain growth is largely saturated for these anneals. Grain growth is shown to be more extensive during RTA anneals than furnace annealing and more extensive in 0.4 {mu}m films than 0.8 {mu}m films for equivalent RTA cycles. The results are discussed in terms of models, simulations and previous results of grain growth in thin metal films. 21 refs., 4 figs.