Abstract
This study discusses the creep-fatigue life prediction of eutectic Sn37Pb solder. Creep-fatigue lives were experimentally obtained at 313 K using fast-fast, slow-slow, slow-fast, fast-slow, and strain-hold waveforms. Conventional four creep-fatigue life prediction rules, time fraction rule, strain range partitioning method, frequency modified fatigue life, and ductility exhaustion model was used to predict the creep-fatigue lives. However, not all the rules were able to properly estimate them. Since the grain boundary sliding rates were closely related to creep-fatigue lives, a new life prediction method based on grain boundary sliding rates was proposed.
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