Abstract

In this study, we report the segregation of magnesium in the grain boundaries of magnesium-doped cuprous oxide (Cu2O:Mg) thin films as revealed by atom probe tomography and the consequences of the dopant presence on the temperature-dependent Hall effect properties. The incorporation of magnesium as a divalent cation was achieved by aerosol-assisted metal organic chemical vapour deposition, followed by thermal treatments under oxidizing conditions. We observe that, in comparison with intrinsic cuprous oxide, the electronic transport is improved in Cu2O:Mg with a reduction of resistivity to 13.3 ± 0.1 Ω cm, despite the reduction of hole mobility in the doped films, due to higher grain-boundary scattering. The Hall carrier concentration dependence with temperature showed the presence of an acceptor level associated with an ionization energy of 125 ± 9 meV, similar to the energy value of a large size impurity−vacancy complex. Atom probe tomography shows a magnesium incorporation of 5%, which is substantially present at the grain boundaries of the Cu2O.

Highlights

  • In this study, we report the segregation of magnesium in the grain boundaries of magnesium-doped cuprous oxide ­(Cu2O:Mg) thin films as revealed by atom probe tomography and the consequences of the dopant presence on the temperature-dependent Hall effect properties

  • We observe a reduction of Hall carrier mobility, which can be attributed to an increase of hole scattering, related to the magnesium incorporation

  • The temperaturedependent mobility values are roughly constant with the increase of temperature in both sets of samples, which is consistent with a grain-boundary-limited type of conduction in randomly-oriented C­ u2O grains

Read more

Summary

Introduction

We report the segregation of magnesium in the grain boundaries of magnesium-doped cuprous oxide ­(Cu2O:Mg) thin films as revealed by atom probe tomography and the consequences of the dopant presence on the temperature-dependent Hall effect properties. In comparison with intrinsic cuprous oxide, the electronic transport is improved in ­Cu2O:Mg with a reduction of resistivity to 13.3 ± 0.1 Ω cm, despite the reduction of hole mobility in the doped films, due to higher grain-boundary scattering. Atom probe tomography shows a magnesium incorporation of 5%, which is substantially present at the grain boundaries of the ­Cu2O. VCu , are considered as the most favorable defect from the point of view of formation energy They are generally created during post-deposition annealing treatments under oxidizing ­conditions[4,5,6].

Methods
Results
Conclusion
Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call