Abstract
This paper deals with intergranular phenomena occurring when copper polycrystals are exposed to liquid bismuth. Grain boundaries (Gbs) exhibit liquid grooving which depends on their crystallographic characteristics. Penetration of Bi is found along the Gbs, ahead of the groove tip. The phenomenon is thermally activated and the time dependence of the Gb penetration is described by linear kinetics. The crystal orientation effect on the intergranular liquid penetration is observed.
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