Abstract
ABSTRACTThe intergranular brittleness in polycrystalline materials is a source of serious problem in material processing and practical applications. To obtain a fundamental knowledge of improvement in the brittleness, we have examined the relationship between fracture behaviour and grain boundary (GB) microstructures in polycrystalline molybdenum. Quantitative analyses of GB microstructures were performed by orientation microscopy (OIM), and followed by 4-points bending tests at 77K. Thereafter, crack propagation was analyzed in connection with GB microstructures. We found the fracture stress depends on the grain size in similar manner to the Hall-Petch relation. In addition, the Hall-Petch relation also depends on the grain boundary character distribution (GBCD). The fracture stress increases with increasing the frequency of low σ GBs at constant grain size. Conversely, random GBs seem to act as weak intrinsic defects and the interconnection among them may give rise to premature failure. Therefore, the connectivity of random GBs probably becomes important as well as the GBCD to suppress the intergranular fracture.
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