Gold Recovery from Thiosulfate Leaching Solution Using Silicon Powder and Electrochemical Monitoring of Its Process

Abstract

Gold recycling from Waste Electrical and Electronic Equipment (WEEE) has been actively conducted. We previously reported a noble metal recovery process using aqua regia and electroless displacement deposition onto silicon powder [1,2]. Using silicon powder has such advantages as that noble metals and copper are selectively recovered, and sawdust silicon, that is, industrial waste silicon powder is available to use. Recently, ammonium thiosulfate solution has attracted attention as a safe and low-cost solution for gold leaching [3-6]. In this study, we successfully recovered gold from an ammonium thiosulfate solution by using silicon powder [7,8], and tried to monitor the recovering behavior electrochemically. Since the ammonium thiosulfate leaching solution includes copper ions as oxidizing agent, copper is recovered by silicon powder. Thus, the monitoring was conducted in order to determine the suitable timing for efficiently obtaining pure gold during the process. For experimentation, an ammonium thiosulfate solution containing gold(I) sulfite and copper(II) sulfate was prepared (pH = 13). We immersed a gold wire in the solution and measured the rest potential during the recovery process using silicon powder. The potential of gold wire shifted stepwise toward negative direction at each start and end of gold and copper recovery. The results suggest that the efficient recovery of high-purity gold can be achieved by monitoring the potential of gold.[1] K. Fukuda, S. Yae, N. Fukumuro, S. Sakamoto, and H. Matsuda, ECS Trans., 53(19), 69 (2013). DOI: 10.1149/05319.0069ecst[2] K. Fukuda, N. Fukumuro, S. Sakamoto, and S. Yae, ECS Trans., 61(10), 1 (2014). DOI: 10.1149/06110.0001ecst[3] M.G. Aylmore and D.M. Muir, Miner. Eng., 14, 135 (2001). DOI: 10.1016/s0892-6875(00)00172-2[4] H. Arima, T. Fujita, and W. Yen, Mater. Trans., 43, 485 (2002). DOI: 10.2320/matertrans.43.485[5] S. Syed, Hydrometallurgy, 115-116, 30 (2012). DOI: 10.1016/j.hydromet.2011.12.012[6] B. Xu, W. Kong, Q. Li, Y. Yang, T. Jiang, and X. Liu, Metals, 7, 222 (2017). DOI: 10.3390/met7060222[7] Y. Iwai, Y. Takashima, A. Matsumoto, and S. Yae, Abst. Interfinish2020 20th world congress, P-E2-001 (2021).[8] Y. Takashima, A. Matsumoto, Y. Iwai, S. Arita, and S. Yae, J. Surf. Finish. Jpn., 73, 98 (2022). DOI: 10.4139/sfj.73.98