Abstract
Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work investigates gold leaching from the PCBs of mobile phones using thiosulphate gold leaching. The effects of various factors on the leaching such as leaching time, and so on in thiosulfate leaching system were discussed. The optimum leaching conditions were as follows; leaching time was 4h, leaching temperature was 25 °C, thiosulfate concentration was 0.5moll−1, ammonia concentration was 1.2moll−1, copper ion concentration was 0.04moll−1, slurry pH was 10, stirring speed was 300rpm, Na2SO3 concentration was 0.1moll−1 respectively. The gold leaching ratio of 95.3% was achieved.
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