Abstract
This study reports the re-emergence of the classical Au and Pd embrittlement problems in micro joints in three-dimensional integrated circuits (3D ICs) applications. Our results indicate that (Au,Pd,Ni)Sn4 can form a continuous layer across entire joints even if the Au and Pd layers are very thin. This morphology is detrimental to the joint reliability. This study shows that it is practically impossible to avoid these embrittlement problems simply by reducing the thickness of Au or Pd layers when the micro joints are smaller than 10μm. An effective solution to eliminate such embrittlement problems is to introduce relatively large amounts of Cu to the micro joints.
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