Abstract
A study has been made of the glow discharge and sputtering characteristics of the two binary alloy targets Cu—6 wt% Ag and Cu—10 wt% Sn. The results were compared with those of a pure copper target in order to investigate the different effects of alloying both elements individually with Cu. It was found that Ag in the Cu Ag alloy activated its oxidizing and nitriding processes while Sn in the Cu Sn target hindered the two processes. On the other hand, alloying the two elements individually with copper enhanced its glow discharge characteristics, where higher current values and lower breakdown voltages were obtained. However, Ag was found to be more effective in improving the above mentioned characteristics than when Sn was used instead. Moreover, the presence of Ag increased the total sputtering yield of the Cu Ag target while Sn on the other hand decreased that of the Cu Sn target at all values of input power chosen.
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