Abstract
The aim of this article was to investigate the microstructural evolution of a eutectic Sn–9%Zn solder alloy as a function of growth rate during transient unidirectional solidification. It was found that globular-like and needle-like Zn-rich phases prevail at growth rates ranging from 0.5 to 2 mm/s and 0.3 to 0.1 mm/s, respectively, with a transition region occurring between these growth rate ranges. The microstructure control in soldering processes can be accomplished by manipulating solidification processing variables such as the cooling rate and the growth rate, since the resulting morphological microstructure depends on heat transfer conditions imposed by solidification, and as a direct consequence will affect the final properties.
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