Abstract
In this paper, we introduced a novel bonding method of glass wafers by Diels–Alder reaction at mild temperature. After standard hydroxylization and aminosilylation, two wafers were modified by 2-furaldehyde and maleic anhydride, respectively. Then they were brought into close contact and tightly held with a clamping fixture. A strong bonding could be achieved by annealing for 5 h at 200 °C. Bonding strength is as high as 1.78 MPa and sufficient for most application of microfluidic chips. This bonding process has the advantages of simple operation and good smoothness of the wafer surface. Mild temperature can prevent the channel of microfluidic chip distorted or collapse and shorten the cooling time.
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