Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling

Abstract

In this paper, we propose glass-interposer (GI) electromagnetic bandgap (EBG) structure with defected ground plane (DGP) for efficient and broadband suppression of power/ground noise coupling. We designed, fabricated, measured, and analyzed a GI-EBG structure with DGP for the first time. The proposed GI-EBG structure with DGP is thoroughly analyzed using the dispersion characteristics and estimated stopband edges, $f_{L}$ and $f_{U}$ . We experimentally verified that the proposed GI-EBG structure with DGP achieved power/ground noise isolation bandgap (below −30 dB) between $f_{L}$ of 5.7 GHz and $f_{U}$ of 11 GHz. Estimation of $f_{L}$ and $f_{U}$ using dispersion analysis, full 3-D electromagnetic (EM) simulation results, and measurement results achieved good correlation. Effectiveness of the proposed GI-EBG structure with DGP on suppression of the power/ground noise coupling to high-speed through glass via (TGV) channel is verified with 3-D EM simulation. As a result, the proposed EBG structure successfully and efficiently suppressed the power/ground noise coupling and improved the eye diagram of the TGV channel. Lastly, we embedded thin alumina film in the proposed EBG structure and achieved even broader power/ground noise suppression between 2.1 and 14.7 GHz.