Abstract
The thermal stability and crystallization behavior of melt spun amorphous Ti 50 Cu 35 Ni 15-x Sn x (x=0, 3, 5, 7) alloys has been studied in by thermal analysis (DSC and DTA) and X-ray diffractometry. Partial replacement of Ni by Sn up to 5 at % in Ti 50 Cu 35 Ni 15 alloy improved thermal stability and glass forming ability. The onset temperature of the first exotherm increased from 739 to 756 K with increasing Sn content x from 0 to 5, and then decreased to 745 K for the alloy with x=7 due to change in crystallization sequence. Melt spun amorphous Ti 50 Cu 35 Ni 12 Sn 3 and Ti 50 Cu 35 Ni 10 Sn 5 alloys exhibit ΔT x exceeding 78 and 76 K, respectively, which is significantly larger than ΔT x of 46 K in Ti 50 Cu 35 Ni 15 alloy. Amorphous Ti 50 Cu 35 Ni 15 alloy crystallized by precipitation of supersaturated cubic Ti(Ni,Cu) phase followed by decomposition into a mixture of TiCu and TiNi at higher temperature. Amorphous Ti 50 Cu 35 Ni 15-x Sn x (x=3, 5) phase crystallized by precipitation of cubic Ti(Ni,Cu) phase, followed by transformation into a mixture of TiNi, TiCu, Ti 3 Sn phases. Amorphous Ti 50 Cu 32 Ni 8 Sn 7 phase crystallized by co- precipitation of cubic Ti(Ni,Cu) phase and unidentified phase, followed by transformation into a mixture of TiNi, TiCu, Ti 3 Sn phases.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Metastable and Nanocrystalline Materials
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
