Abstract
AbstractGlancing incidence x-ray diffraction (GIXRD) is a powerful diagnostic tool for nondestructive analysis of thin film materials and structures. GIXRD fundamentals and experimental techniques and results are presented with respect to polycrystalline thin-films. The refraction index and critical incident beam angle are calculated for selected elemental and inorganic compounds. Quantitative GIXRD analysis with Cu Kα radiation is applied to several problems: recrystallization of ultra-thin chemical surface deposited CdS films; compositional grading in CuIn1-xGaxSe2films; formation of native oxides on CdTe films; interdiffusion between CdTe and CdS; Te film thickness determination on etched CdTe; and correlation of inplane residual stress with deposition conditions for sputtered Mo films.
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