Abstract

We present a study of germanium as an alternative to silicon for n-type doping of cubic GaN. We find that Ge is a well-suited donor impurity. Our layers were grown by plasma-assisted molecular beam epitaxy on 3C-SiC/Si (001) substrates. Germanium-doped layers were fabricated with donor concentrations ranging over several orders of magnitude up to 3.7 × 1020 cm−3. For comparison, silicon-doped layers with donor concentrations of up to 3.8 × 1019 cm−3 were also grown. Incorporation of germanium into the cubic GaN layers was verified by time-of-flight secondary ion mass spectrometry. The crystalline quality of our layers was analyzed using high-resolution x-ray diffraction. Germanium- as well as silicon-doped layers with donor concentrations above 1019 cm−3 exhibited an increase of the dislocation density with increasing dopant concentration. The surface topography of our layers was investigated by atomic force microscopy. Comparable values for the surface roughness were measured for germanium- as well as silicon-doped layers. Optical properties were investigated by photoluminescence spectroscopy at 13 K. Doping with silicon resulted in a spectrally slightly narrower luminescence than doping with germanium. Donor concentrations and carrier mobilities were determined by Hall effect measurements at room temperature and we observe 20% higher electron mobilities for Ge-doping compared to Si-doping in the case of high dopant concentrations.

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