Abstract
AbstractThere is a growing interest in developing advanced materials for thin film applications in biology, electronics, photonics and engineering. We report the development of hybrid inorganic/organic thin films containing nickel, iron and cobalt paramagnetic materials. By etching the resist in oxygen plasma after processing, most of the organic component of the resist was removed. The elemental chemical composition of the films was confirmed by energy dispersive X‐ray spectroscopy. This process can potentially lead to patterning paramagnetic thin films containing paramagnetic materials by following standard photolithography protocols, obviating the need for a wet or vacuum metal deposition. Copyright © 2010 John Wiley & Sons, Ltd.
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