Abstract
High aspect ratio microstructure systems with nearly vertical walls are routinely produced by conventional deep x-ray lithography. More complex structures, in which the height is an arbitrary function of position, have many practical applications, for example, as molds for arrays of microscopic optical elements. We have demonstrated a very accurate technique by which such structures may be fabricated by an entirely dry process, using the x-ray ablation of heated Teflon [poly(tetrafluoroethylene)] in an x-ray lithography beamline at the Center for Advanced Microstructures and Devices at Louisiana State University. We observed that the total amount of material ablated is directly proportional to the incident dose. By using a half tone mask, the dose, and hence the amount of material removed, may be accurately controlled at every point on the sample.
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Schedule a callMore From: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
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