Abstract
TiNi films with different Ti/Ni ratios were prepared by co-sputtering Ti50Ni50 (at%) target with Ti target at temperature of 723 K. The stress values in the deposited films changed significantly with Ti contents and post-annealing temperatures due to the differences in phase transformation behaviors and intrinsic stress. Post-annealing of these films at 923 K for 1 hour could modify the intrinsic stress and martensite transformation behavior thus cause the significant decrease in residual stress. For all three types of film annealed at 1023 K for 1 hour, the large stress in the thin films could damage the shape memory effect or result in the peeling-off of film from Si substrate.
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