Abstract
Intermetallic compound (IMC) formation is important for the reliability of microelectronic devices. In this work, a generalized phenomenological model was developed to explain the effects of electromigration on IMC growth by considering reaction and diffusion of two species. When both reaction and mass transfer are important, the model predicts cathode enhancement and anode thinning if the electromigration effect on the dominant diffusion species is more pronounced. Cathode suppression and anode enhancement occur when the electromigration effect on the minor diffusion species is more pronounced. Simultaneous cathode and anode suppressions happen when there are two diffusion species and the diffusion and electromigration fluxes are comparable. Simultaneous cathode and anode enhancements occur when mass transfer is the limiting step and diffusion flux is negligible compared to electromigration. This model was found to be consistent with experiment data on IMC growth in the literature given the limited amount of information on effective charge of various species.
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