Abstract
본 논문에서는 Generalized Hough Transform (GHT)와 Chamfer 정합(Chamfer matching)방법을 결합하여, 두 방법의 약점을 보완하는 새로운 이차원 에지기반 매칭기법이 제시된다. 먼저, GHT를 적용하여, 물체의 대략적인 위치와 방향을 추정하고, 이를 시작점으로 하여, 보다 정확한 위치와 방향을 Chamfer 정합기법을 적용하여 찾았다. 끝으로, 서브픽셀(subpixel) 알고리즘을 사용하여, 매칭정확도를 향상시켰다. 제안된 알고리즘은 다양한 전자부품 영상에 대해 실험한 결과 좋은 결과를 나타내었다. In this paper, a 2-dimensional edge-based matching algorithm is proposed that combines the generalized Hough transform (GHT) and the Chamfer matching to complement weakness of either method. First, the GHT is used to find approximate object positions and orientations, and then these positions and orientations are used as starling parameter values to find more accurate position and orientation using the Chamfer matching. Finally, matching accuracy is further refined by using a subpixel algorithm. The algorithm was implemented and successfully tested on a number of images containing various electronic components.
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