Geant4 simulation of proton-induced single event upset in three-dimensional die-stacked SRAM device**Project supported by the National Natural Science Foundation of China (Grant Nos. 11690041 and 11675233) and the Fund from the Science and Technology on Analog Integrated Circuit Laboratory, China (Grant No. JCKY2019210C054).

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Geant4 Monte Carlo simulation results of the single event upset (SEU) induced by protons with energy ranging from 0.3 MeV to 1 GeV are reported. The SEU cross section for planar and three-dimensional (3D) die-stacked SRAM are calculated. The results show that the SEU cross sections of the planar device and the 3D device are different from each other under low energy proton direct ionization mechanism, but almost the same for the high energy proton. Besides, the multi-bit upset (MBU) ratio and pattern are presented and analyzed. The results indicate that the MBU ratio of the 3D die-stacked device is higher than that of the planar device, and the MBU patterns are more complicated. Finally, the on-orbit upset rate for the 3D die-stacked device and the planar device are calculated by SPACE RADIATION software. The calculation results indicate that no matter what the orbital parameters and shielding conditions are, the on-orbit upset rate of planar device is higher than that of 3D die-stacked device.