Abstract
The reliability of the gate oxide on large-area surface defects (trapezoid-shaped and obtuse triangular defects) in 4H-SiC epitaxial wafers is discussed. Time-dependent dielectric breakdown measurements revealed that a reduction in charge-to-breakdown (Qbd) occurred at a MOS capacitor including the downstream line of those defects. The deterioration of Qbd was at the same level in trapezoid-shaped defects and obtuse triangular defects. A cross-sectional transmission electron microscope (TEM) image and the simulation of the electric field distribution for the MOS structure indicated that the local fluctuation of the oxide thickness and/or the roughness of the interface on the downstream lines caused the degradation of the reliability of the MOS capacitors.
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