Gate Optimization Analysis of Injection Molding for Mobile Phone Panel Based on Moldflow and Drop Simulation

Chunhua Sun,Hongbing Wang

doi:10.4236/wjet.2021.91007

Abstract

Aiming at the gate design problem of a mobile phone panel, the plastic forming analysis software Moldflow and drop simulation were used to optimize the gate design. Six different gate design schemes were compared and studied, and the weld lines positions and injection molding results under each gate scheme were analyzed.Through the simulation analysis of the falling process of the mobile phone panel by the display dynamics analysis software ANSYS Workbench LS-DYNA, five analysis schemes were set according to the falling angle, and the stress distribution at the weld lines positions of the mobile phone panel in each scheme was studied. The reasonable gate scheme was given by synthesizing the force condition, the mold flow analysis and the drop simulation results of the mobile phone panel in use. Based on the results of die flow analysis and drop simulation the optimal gate design scheme 2 is found, and the weld line position avoids the lower part of the elliptical hole, which is the weak part of the structure. The research results had certain reference significance for the optimization of injection process of plastic products.

Highlights

In the process of injection molding, there are many factors that affect the quality of products
The reasonable gate scheme was given by synthesizing the force condition, the mold flow analysis and the drop simulation results of the mobile phone panel in use
Based on the results of die flow analysis and drop simulation the optimal gate design scheme 2 is found, and the weld line position avoids the lower part of the elliptical hole, which is the weak part of the structure

Summary

Introduction

In the process of injection molding, there are many factors that affect the quality of products. Many of the electronic products are made of plastic Various defects such as weld mark, warpage, crack, silver wire, etc will appear in the molding process of plastic products. It is necessary to combine the drop process analysis in the process of product injection molding analysis to improve the quality of products [3] [4] [5]. In this paper, aiming at the problem of weld line defects in the injection process of a key phone panel, the injection process is optimized by using Moldflow and drop simulation. The product defects are effectively solved, and the analysis process has a good reference for the comprehensive use of mold CAE software and drop simulation method to analyze the injection process of plastic parts

Modeling and Mesh Generation of the Mobile Phone Panel

Gate Design of Mobile Phone Panel

Drop Analysis of Mobile Phone Panel

Findings

Conclusions