Abstract
The novel growth method of GaN using hydrogen radicals has been investigated. This paper is the first report of gallium hydrogenation reaction and deposition of GaN using hydrogenated gallium. We found that gallium (Ga) could be volatilized at low temperature by hydrogenation reaction with hydrogen radicals. In this reaction, Ga assumed to be volatilized as GaH 3. The GaN deposition was attempted by using gas phase reaction of NH 3 and GaH 3 generated by the reaction between liquid Ga and hydrogen radicals. Hydrogen radicals were generated by hot tungsten filament, which works as a catalyst during hydrogen cracking, whose temperature was 1600 °C. Surface morphology, deposition rate, and film structure were investigated. It was confirmed that GaN could be deposited by this method. The source materials of this method are safe and of low cost compared to the conventional methods.
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