Abstract
Linear sweep voltammetry, galvanostatic pulse, and pulse reverse techniques were used to study the plating of nickel‐iron alloys in the presence of organic additives. The effects of pulse current densities, , reverse current densities, , rotation speed of disk electrode, and the presence of organic additives on deposition of nickel‐iron alloys are evaluated. The observed phenomena can be explained by the concentration depletion of reactants (or products), and the surface coverage of the additives on the electrode. A new formulation of the plating bath is defined.
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