Abstract
Galvanic interactions which occur between gold and sulfide minerals have a significant impact on the leaching behaviour of gold in copper-ammonia-thiosulfate solutions. At low ammonia concentrations, gold leaches very slowly due to the low Cu(II) concentration. However when electrically connected to unreactive sulfide minerals, the gold leaches much more rapidly as a result of the concurrent reduction of Cu(II) and dissolved oxygen on the mineral surface. At higher ammonia concentrations, the leaching of gold occurs readily due to the high concentration of Cu(II). However, if the gold is electrically connected to chalcocite, there is preferential oxidation of the chalcocite, and hence cathodic protection of the gold. This results in a low gold leach rate and mixed potential.
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